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Mounting Technology Product List and Ranking from 12 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

Mounting Technology Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 光山電気工業 Gunma//Industrial Electrical Equipment 拡販推進
  2. 三幸電機 Aichi//Industrial Electrical Equipment
  3. JOHNAN DMS Kyoto//Electronic Components and Semiconductors
  4. 4 AndTech Kanagawa//Service Industry
  5. 5 TECHNICAL INFOMATION INSTITUTE CO.,LTD Tokyo//Service Industry
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Mounting Technology Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. COB implementation technology 光山電気工業 拡販推進
  2. [EMS Implementation Technology] 0603 Size Chip Component Mounting Technology 三幸電機
  3. To miniaturize and slim down products! Functional film implementation technology. JOHNAN DMS
  4. 4 Design, structure, assembly technology of LED packages, and implementation technology onto substrates. AndTech
  5. 4 Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD) TECHNICAL INFOMATION INSTITUTE CO.,LTD

Mounting Technology Product List

1～15 item / All 19 items

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Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)

Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)

Technical Specialized Books - Focusing on Automotive and 5G Applications

Unraveling substrate, wiring, mounting materials, and mounting technology aimed at "miniaturization and high density," "high speed and high frequency," and "flexibility." ■ Key points of this book ◎ Response to automotive and miniaturization for high density ◎ Response to 5G and high-speed communication ◎ Advancement of mounting and design technology

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  • others
  • Technical and Reference Books
  • Technical and Reference Books

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"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

Challenging the limits of ultra-small diameter bumps! Achieving the world's smallest level 25um crimp diameter bump with compact, high-density mounting technology!

Hakodate Electronics Co., Ltd. is engaged in the development of fine-pitch gold stud bump processing technology and the development of mounting structures utilizing gold stud bumps through prototype development. By advancing the technology for miniaturization and fine-pitching of Au stud bumps, we achieve the world's smallest level of 25μm bonding diameter bumps. 【Bump Diameter Comparison】 ■ Bump Bonding Diameter (Bump Pitch) - 88μm (90μm) - 61μm (70μm) - 51μm (60μm) - 40μm (50μm) - 25μm (28μm) *For more details, please feel free to contact us.

  • Other mounting machines

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High-density packaging technology "FCB & COF"

High-density packaging technology "FCB & COF"

It is possible to further reduce the implementation area compared to the WB method, enabling miniaturization on printed circuit boards.

"FCB&COF (Flip Chip Bonding) & COF (Chip on FPC)" is a method that forms bumps on the electrode part of a semiconductor chip and connects it by placing it directly on the electrodes of a printed circuit board (face down) while applying heat. It is also possible to implement it in combination with SMT, enabling miniaturization of the module. 【Features】 ■ Miniaturization on printed circuit boards is possible ■ Implementation in combination with SMT is also possible ■ Miniaturization of the module is possible *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Contract manufacturing

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AEMtec GmbH Company Profile

AEMtec GmbH Company Profile

German semiconductor venture! High-precision, high-density implementation ODM spun out from Infineon.

Our company provides advanced chip direct mounting technology for optoelectronics and sensor systems, offering a consistent contract manufacturing development process from design, process development, prototyping to mass production. We provide advanced mounting technology for various fields including electronic medical devices, industrial equipment, automatic control equipment, data processing and information communication, as well as semiconductor manufacturing equipment. In the case of unitization, high-quality unit assembly with semi-automated processes can be achieved. 【Business Content】 ■ Product and Process Development ■ Mass Production ■ Supply Chain Management *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts

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Notice of Participation in Japan Manufacturing World

Notice of Participation in Japan Manufacturing World

We will exhibit at the 34th Design and Manufacturing Solutions Expo. We will showcase our technologies related to manufacturing that we have developed at Sony.

We will introduce our technology that addresses your concerns related to product design, manufacturing, and other aspects of manufacturing, as well as help realize your ideas of "I want to try this." If you have time, please visit our booth. 【Exhibition Information】 - Exhibition Name: Japan Manufacturing World 34th Design & Manufacturing Solutions Expo - Dates: June 22, 2022 (Wednesday) to June 24, 2022 (Friday) - Opening Hours: 10:00 AM to 6:00 PM (Ends at 5:00 PM only on June 24) - Venue: Tokyo Big Sight - Booth Number: 14-31 - Official Website: https://www.japan-mfg.jp/ja-jp.html 【Main Exhibition Contents】 - Element technologies to realize "I want to create this product" - Design capabilities that give you a "step" ahead of competitors - Implementation technologies that support the miniaturization and weight reduction of Sony products - Sony-quality manufacturing that can also accommodate medical devices - Custom power supplies/chargers tailored to a wide variety of needs You can check the list of manufacturing services available for download in PDF format.

  • Other contract services
  • Contract manufacturing

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Kanda Industrial Co., Ltd. SMT Business

Kanda Industrial Co., Ltd. SMT Business

We offer our manufacturing and processing facilities to fabless companies! Let us introduce our SMT business.

At Kanda Industrial Co., Ltd.'s "SMT Division," we respond to various types of mounting, including high density, high precision (±50μm), fine, and large components with advanced technology. We accommodate not only standard sizes like 1005 and 0603 but also small chip components such as 0402, as well as irregular components like BGA (Ball Grid Array), CSP (Chip Size Package), and flip chips. Additionally, as a one-stop production facility for component mounting, we are equipped to handle everything from prototypes and small batch production to mass production, tailored to meet your needs. Please feel free to contact us when you need assistance. 【Features】 ■ Equipped to handle everything from prototypes and small batch production to mass production ■ Responding to various types of mounting, including high density, high precision (±50μm), fine, and large components with advanced technology ■ Providing manufacturing and processing facilities for fabless companies *For more details, please refer to the related link page or feel free to contact us.

  • Contract manufacturing
  • Processing Contract
  • Other electronic parts

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Introduction to Implementation Technology for Functional Films

Introduction to Implementation Technology for Functional Films

Contributes to the miniaturization, thinning, and lightweighting of products.

JOHNAN DMS Corporation is advancing the development of implementation technology for functional films aimed at miniaturizing and thinning products in industries such as automotive (in-vehicle), medical and healthcare devices, and infrastructure. The implementation technology for functional films contributes to solving challenges in product mechanism design. For more details, please refer to the related links.

  • Circuit board design and manufacturing

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To miniaturize and slim down products! Functional film implementation technology.

To miniaturize and slim down products! Functional film implementation technology.

We provide implementation services for hot melt molding, wearable devices, and stretchable films.

JOHNAN DMS Corporation is currently developing a new technology called "implementation technology for functional films" to expand the possibilities of miniaturization and thinness of products, which are in demand across various industry sectors. This technology enables implementation onto films with elasticity, allowing for adaptation to various shapes such as curves. Using this technology, we provide implementation services for "hot melt molding," "wearable devices," and "stretchable films." You can find detailed information about each service on our company website.

  • Other mounting machines

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★Trend of Transparent Resin: Resin with Fluorescent Materials! Low Stress Resinization! High Refractive Index!

**Lecture Summary** Semiconductor packaging technology is an important technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from SiP (System in Package) using multi-layer stacking of elements to MiP (Multi functions in a Package), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes a crucial technology for the MiP era, this presentation will provide an overview of the current LED assembly technology and discuss future development directions and impacts on the market.

  • Technical Seminar
  • LED Module
  • LED lighting

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COB high-density implementation problem solving

COB high-density implementation problem solving

Leave the implementation challenges to us! We will propose solutions with our unique design and know-how.

We propose unique design and implementation know-how using the technology accumulated through various achievements, covering package structure, bonding methods, and material selection. With our technical expertise and know-how in bonding methods for semiconductor bare chips, measurement, inspection, and reliability evaluation, we support our customers in solving their challenges. 【Challenges → Solutions】 ■ Want to implement without voids → Design and create dedicated FC fixtures ■ Want to use FC but can only obtain chips individually → Form bumps on individual pieces using a bump bonder ■ Implementing at an overseas factory but yield is not improving → Reassess conditions within our company. Reproduce NG and point out areas for review. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other mounting machines

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COB implementation technology

COB implementation technology

We respond to a variety of needs, focusing on the implementation of electronic components, including those equipped with bare chips.

Our company's "COB implementation technology" focuses on the mass production line for the mounting and assembly of electronic components, primarily using bare chips. "COB" refers to a high-density circuit board that directly mounts IC chips onto substrates, enabling the miniaturization and thinness of devices. We offer a comprehensive range of services from component procurement to substrate mounting, finished product assembly, and inspection, utilizing a wide array of implementation technologies such as wire bonding, die bonding, thick film printing, and lead-free/eutectic soldering. 【COB Manufacturing Line】 1) Wafer dicing 2) Die bonding 3) Wire bonding 4) Automatic mounting of SMD components 5) Electrical characteristic testing *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • ASIC
  • Dedicated IC

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[EMS Implementation Technology] 0603 Size Chip Component Mounting Technology

[EMS Implementation Technology] 0603 Size Chip Component Mounting Technology

Stable board mounting is possible even with small electronic components of size 0603! It can maintain the same soldering quality as before, even with high-density mounting.

**Features** - Miniaturization and space-saving of the substrate size By reducing the substrate size, product placement can be considered. - Maintaining soldering assembly quality through image inspection and continuity testing Our image inspection equipment and flying circuit checker enable quality confirmation inspections for assembly. - Usable even with mixed substrates of large power electronic components It is possible to mount 0603 size chips even on artwork substrates mixed with large discrete components. - Leave the design of 0603 size substrate artwork to us If you entrust us with the artwork design for 0603 size chip assembly substrates, we will design it to match our assembly equipment, ensuring better assembly quality. *For implementation evaluation data and verification details for 0603 size chips, please contact us below.*

  • EMS
  • Contract manufacturing
  • Circuit board design and manufacturing

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Contributing to miniaturization with high-density packaging.

Contributing to miniaturization with high-density packaging.

We achieve narrow GAP implementation and miniaturization of high-quality implementation boards.

We support the implementation of small chip components that are essential for miniaturizing substrates, as well as their narrow gap mounting. Our company has contributed to the miniaturization of Sony products by pursuing high-density mounting technology. We provide high-quality support for high-density mounting, such as the implementation of 0402 size components used in mobile devices like smartphones. Additionally, we can also accommodate even smaller 0201 and 03015 size component implementations. 【Features】 ■ Implementation of 0402 size components with narrow gaps ■ Capable of mixed mounting with large components (such as connectors) ■ Also supports the implementation of 0201 and 03015 size components ■ Equipped with solder printing inspection machines, pre-reflow inspection machines, and post-reflow inspection machines to ensure high quality *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★New manufacturing methods (tandemization of multiple wavelengths, MCM, organic LEDs) ★Topics on phosphors (such as sialon phosphors) and key points of phosphor coating technology.

Speaker Mr. Gen Murakami, Ph.D. in Engineering, Representative Director of Genten Co., Ltd. Target Audience: Engineers, researchers, and relevant departments facing challenges with LED packages Venue: Tekno Kawasaki, 5th Floor, Room 5 [Kanagawa, Kawasaki] 10-minute walk from JR Nambu Line "Musashi-Mizonokuchi" Station Date and Time: March 29, 2011 (Tuesday) 12:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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High-reliability mounting technology for electrical equipment

High-reliability mounting technology for electrical equipment

Solving your challenges! We provide implementation technology compatible with electronics.

At Oki Electric Industry, we provide mounting technologies that respond to the accelerating trend of electronics. We ensure high reliability with high-strength solder materials that meet our unique reliability evaluation standards. We solve our customers' challenges. 【Case Study】 ■Challenge - The adoption of electronic devices in harsh environments, such as around ECUs and engines, is progressing, making high reliability a pressing need. ■Solution - High reliability is ensured with high-strength solder materials that meet our unique reliability evaluation standards. - High reliability is guaranteed through 100% inspection of all pins using high-speed 3D X-ray inspection technology. *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines

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